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 U3661M
Baseband Delay Line (64 ms)
Application
In TV sets, the integrated baseband delay line circuit is suitable for decoders with color-difference signal outputs
Description
The integrated delay line circuit U3661M is suitable for all chroma decoders with baseband color-difference outputs. It is suitable for PAL-, SECAM- and NTSC-signals as well. The U3661M contains two separate delay lines for processing (R-Y)-output and (B-Y)-output separately. The delay is performed by internally switched capacitors. On-chip postfiltering avoids the need for external filter components. A summing circuitry combines the information of adjacent TV-lines, thus giving an interpolated sum for the PAL-system, storing preceeding lines for the SECAMsystem and providing a comb-filtered output for NTSC-signals. Due to internally-generated timing, synchronization is easily done by feeding a line-frequent impulse (usually the SC-impulse) to the sync-input of the IC.
Features
D One line delay time, addition of delayed and
non-delayed output signals
D Line-locked by the sandcastle pulse D No crosstalk between SECAM color
carriers (diaphoty)
D Adjustment-free application, VCO without
external components
D Handles negative or positive color-difference
input signals
D Comb filtering functions for NTSC
color-difference signals
D Clamping of ac-coupled input signals
[(R-Y) and (B-Y)]
D Correction of phase errors in the PAL system
"(B-Y) 14 "(R-Y) 16
VRef Clamping Line memory Shift register Clamping
S+H S+H LPF
+
12
"(B-Y) "(R-Y)
Line memory VRef
+
11
LPF
Bias fSC VDD2 GND2 1
SC detector
3 MHz Control 9 PLL
Clock generator
VDD1 GND1
3 5
94 8846
10
SC pulse
Figure 1. Block diagram
TELEFUNKEN Semiconductors Rev. A1, 17-Jul-96
1 (9)
Preliminary Information
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* MIL standard 883D, method 3015.7 machine model (all power pins connected together) Reference point Pin 3, 10, unless otherwise specified
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Pin Description Ordering Information
Thermal Resistance
Operating Range
Absolute Maximum Ratings
U3661M
2 (9)
Junction ambient
Parameters Supply voltage range (Pin 1, Pin 9) Ambient temperature range
Parameters Supply voltage (Pin 9) Supply voltage (Pin 1) Voltage on Pins 5, 11, 12, 14 and 16 Output current (Pin 11, Pin 12) Power dissipation Storage temperature range Electrostatic protection* for input/ output pins
NC
GND2
NC
VDD2
NC
NC
NC
SC
Extended Type Number U3661M-ADP U3661M-AFP
Figure 2. Connection diagram
8
5
3
1
7
6
4
2
Parameters
95 10649
Preliminary Information
10 GND1 11 V0(R-Y) 12 Vo(B-Y) 13 NC 14 Vi(B-Y) 15 NC 16 Vi(R-Y) 9 VDD1 Package DIP16 SO16 Symbol VDD1 VDD2 Vn Iout P Tstg Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Symbol RthJA Symbol Vs Tamb Symbol VDD2 NC GND2 NC SC NC NC NC VDD1 GND1 Vo (R-Y) Vo (B-Y) NC Vi (B-Y) NC Vi (R-Y) Min. -0.5 -0.5 -0.5 -25
Function Supply voltage for digital part Not connected Ground for digital part Not connected Sandcastle-pulse input Not connected Not connected Not connected Supply voltage for analog part Ground for analog part (R-Y) output signal (B-Y) output signal Not connected (B-Y) input signal Not connected (R-Y) input signal
TELEFUNKEN Semiconductors Rev. A1, 17-Jul-96 Value 4.5 to 5.5 -10 to +70 Value 80 Typ. Remarks Max. +7 +7 VS 20 1.1 +150 500 Unit K/W Unit V C Unit V V V mA W C V
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VDD = 5.0 V, Tamb = 25C, reference point, Pin 3 and Pin 10 connected together, sandcastle frequency of 15.625 kHz; unless otherwise specified
TELEFUNKEN Semiconductors Rev. A1, 17-Jul-96
Input clamping voltage
Electrical Characteristics
Non-color input level during clamping Color-difference output signals Pin 11, 12 Output signal Pin 11 (peak-to-peak value) (R-Y) All standards (B-Y) All standards Pin 12 Ratio of output amplitudes at equal input signals DC output voltage Pin 11, 12 Output resistance Pin 11, 12 Gain for PAL and NTSC Ratio Vo / Vi Gain for SECAM Ratio Vo / Vi Ratio of output signals for Vi 14,16 = 1.33 Vpp SECAM signals adjacent time samples at Pin 11 / Pin 12 constant input signals Noise voltage Vi 14,16 = 0, Rgen < 300 W (RMS value) f = 10 kHz to 1 MHz, Pin 11, 12 Delay of delayed signals Delay of non-delayed signals Transient time of delayed 300 ns transient of SECAM input signal signal, Cload =22 pF, Pin 11, 12 Transient time of 300 ns transient of SECAM input non-delayed signal signal, Cload = 22 pF, Pin 11, 12 Sandcastle-pulse input Pin 5 Sandcastle frequency Top pulse voltage The leading edge of the burst-key pulse is used for timing Internal slicing level Input current Input capacitance
Parameters Test Conditions / Pins DC-supply Pin 1, 9 Supply voltage (analog part) Pin 9 Supply voltage (digital part) Pin 1 Supply current (analog part) Pin 9 Supply current (digital part) Pin 1 Power dissipation Color-difference input signals Pin 14, 16 Input signal (peak-to-peak value) Pin 16 (R-Y) PAL and NTSC (B-Y) PAL and NTSC Pin 14 (R-Y) SECAM Pin 16 (B-Y) SECAM Pin 14 Input resistance During clamping Input capacitance
Preliminary Information
Vi Vi Vi Vi R14, R16 C14 C16 V14 V16 Vo Vo V11/V12 Symbol V11,12 R11,12 Gv Gv V(n)/ V(n+1) Vnoise VDD1 VDD2 IS1 IS2 P Vslice I5 C5 fSC V5 ttr td td ttr V5-1.5 63.94 Min. 14.0 3 5.5 -0.5 -0.4 4.5 4.5 V5-1.25 15.625 0.525 0.665 1.05 1.33 6.0 0 0.1 Typ. 64.0 65 550 1.05 1.33 0 1.45 350 3.0 5.0 5.0 3.5 1 30
U3661M
17.0 Vs+0.7
V5-1.0 10 10
64.06
Max.
400 6.5 +0.5
+0.4
1.2
1.0 1.0 2.0 2.0 40 10
5.5 5.5 8.0 2 60
Unit
V V mA mA mW
kHz V
mV
V A pF
V V V V kW pF
dB dB dB
V V dB
s ns ns
ns
W
V
V
3 (9)
U3661M
BGP
SC-impulse
H-pulse
Internal clamping
0.3 ms 1.6 ms
Figure 3. Timing of internal clamping
95 10355
BGP 1.6 V
No higher than VS + 0.7 V At least 1.6 V
H V
95 10226
Figure 4. Restrictions to SC Pulse
4 (9)
Preliminary Information
TELEFUNKEN Semiconductors Rev. A1, 17-Jul-96
U3661M
+12 V 560 W 10 W 47 mF 10 W 47 mF
5V1
22 nF
22 nF 1 9
NC
94 8848
"(R-Y)
Chroma decoder
2,4,6,7,8,13,15 11
16 1 nF 14 1 nF 5 3 10
"(R-Y) "(B-Y)
"(B-Y)
Baseband delay line
12
SC pulse
*)
*)
Figure 5. Typical application circuit
*) Depends on application (5 V - or 12 V SC pulse)
Baseband delay line
SC-impulse 12 V 10 kW 6.8 kW
95 10227
Baseband delay line
SC-impulse 5 SC in 5V
5 SC in
95 10354
Figure 6. Application with 12 V SC-pulse
Figure 7. Application with 5 V SC-pulse
TELEFUNKEN Semiconductors Rev. A1, 17-Jul-96
5 (9)
Preliminary Information
U3661M
Internal Pin Circuits
14,16
5
95 10356
Figure 8. Color-difference signal inputs
95 10357
Figure 10. Sandcastle-pulse input
95 10359
11,12
1,9
Figure 9. Color-difference signal outputs
Figure 11. Supply voltage VDD2, VDD1
6 (9)
Preliminary Information
AA
95 10358
TELEFUNKEN Semiconductors Rev. A1, 17-Jul-96
U3661M
Package Information
Package DIP16
Dimensions in mm
20.0 max 19.8 max 7.82 7.42
4.8 max 0.5 min 3.3
6.4 max 0.39 max 9.75 8.15
1.64 1.44 17.78 Alternative 16 15 14 13
0.58 0.48
2.54
12
11
10
9
technical drawings according to DIN specifications
96 11709
1
2
3
4
5
6
7
8
Package DIP16
Dimensions in mm
20.57 18.92 0.76 0.13 7.87 7.37
3.81 3.05
0.89 0.38 3.81 3.05 1.60 0.64 1.65 1.14 0.58 0.38 0.38 0.20
6.60 6.10
0.81 2.79 2.29 9.40 7.62
technical drawings according to DIN specifications
96 11650
TELEFUNKEN Semiconductors Rev. A1, 17-Jul-96
7 (9)
Preliminary Information
U3661M
Package Information
Package SO16
Dimensions in mm
94 8875
8 (9)
Preliminary Information
TELEFUNKEN Semiconductors Rev. A1, 17-Jul-96
U3661M
Ozone Depleting Substances Policy Statement
It is the policy of TEMIC TELEFUNKEN microelectronic GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances ( ODSs). The Montreal Protocol ( 1987) and its London Amendments ( 1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. TEMIC TELEFUNKEN microelectronic GmbH semiconductor division has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2 . Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency ( EPA) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C ( transitional substances ) respectively. TEMIC can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances.
We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use TEMIC products for any unintended or unauthorized application, the buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. TEMIC TELEFUNKEN microelectronic GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Telephone: 49 ( 0 ) 7131 67 2831, Fax number: 49 ( 0 ) 7131 67 2423
TELEFUNKEN Semiconductors Rev. A1, 17-Jul-96
9 (9)
Preliminary Information


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